JCPCB
⚡ Advanced PCB — Where Others Stop, We Start

Advanced PCB Manufacturing
Pushing the Limits of What's Possible

Any-layer HDI, Rogers high-frequency hybrid, IC packaging substrates, metal-core thermal solutions, rigid-flex — JCPCB's advanced production lines specialize in what others can't or won't build.

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Any-Layer HDI

HDI (High Density Interconnect)

The backbone of smartphones, wearables, and 5G modules. Our production lines support 1-3+ stage HDI with any-layer interconnect, 0.075mm minimum laser micro-via, meeting the densest BGA fanout requirements.

Technical Specifications

Ultimate capability parameters
HDI Stages1 / 2 / 3 / Any-layer
Laser Micro-Via0.075mm minimum diameter
Min Trace/Space2/2mil (0.05mm) ultimate capability
BGA Fanout0.3mm pitch BGA direct fanout
Stacked Via2-6 layer stacked vias
Depth RoutingControlled-depth routing any layer
Via-in-PadFree VIPPO for 6+ layer orders
Layer Range4-24 layer HDI

Starting From

$18.00

Lead Time: 5-7 days

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Typical Applications

5G mmWave Modules
Smartphone Mainboards
AR/VR Devices
AI Accelerator Cards
FPGA Dev Boards
Rogers / PTFE

High-Frequency / RF Boards

RF circuits demand extremely low material loss and precise impedance. Our advanced production lines handle Rogers RO4003/RO4350B, PTFE, Megtron 6 low-loss materials with hybrid stackups (Rogers+FR-4) and ±1% precision impedance control.

Technical Specifications

Ultimate capability parameters
MaterialsRogers RO4003/RO4350B, RT/Duroid 5880, PTFE
Hybrid StackupRogers + FR-4 mixed construction
Loss TangentDf ≤ 0.0017 @ 10GHz
Dielectric ConstantDk 2.2-10.2 available
Impedance±1% precision control (TDR verified)
Surface FinishENIG / Gold / Silver (low insertion loss)
Min Trace3mil (0.076mm)
Frequency RangeDC to 77GHz

Starting From

$35.00

Lead Time: 7-10 days

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Typical Applications

5G Base Station Antennas
Radar Sensors
Satellite Communication
WiFi 6/7 Modules
Automotive Radar (77GHz)
Advanced Package

IC Packaging Substrates

Chip packaging substrates demand semiconductor-grade precision. We produce BGA/CSP/FC-CSP packaging substrates with trace/space down to 8μm, meeting AI chip, GPU, and memory chip packaging requirements.

Technical Specifications

Ultimate capability parameters
Package TypesBGA, CSP, FC-CSP, SiP, QFN
Trace/Space8/8μm (fine capability)
Min Hole50μm laser micro-via
Layers2-12 layers
Surface FinishENEPIG / ENEP / Electrolytic Ni/Pd/Au
Warpage Control≤0.1mm (substrate level)
ProcessSAP / mSAP semi-additive
ReliabilityJEDEC Level 3 preconditioning

Starting From

Quote Req.

Lead Time: 10-15 days

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Typical Applications

AI Accelerator Packages
GPU Substrates
Memory CSP
PMIC Modules
RF Front-End Modules
Thermal Management

Metal-Core PCB (MCPCB)

High-power applications live or die by thermal management. Our aluminum (MCPCB), copper, and copper-foil substrates deliver industry-leading thermal conductivity with embedded copper coins for thermal resistance as low as 0.05°C/W.

Technical Specifications

Ultimate capability parameters
SubstrateAluminum / Copper / Copper foil / Ceramic
Thermal Conductivity1-8 W/mK (aluminum), >200 W/mK (copper)
Copper Weight1-10oz thermal layer
Embedded CoinsCustom copper coin inserts
Max Size600mm × 1200mm
Withstand VoltageUp to 4kV AC
CTI>600V comparative tracking index
Operating Temp-55°C to +150°C

Starting From

$5.00

Lead Time: 3-5 days

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Typical Applications

High-Power LED
IGBT Power Modules
EV Motor Drives
Power Adapters
Mining Rig Boards
Flex & Rigid-Flex

Flex & Rigid-Flex PCBs

Wearables, foldable screens, and medical devices require flexible circuits. We produce single-sided FPC through 8-layer rigid-flex boards with dynamic bend life ≥1 million cycles, supporting EMI shielding, stiffeners, and custom die-cut outlines.

Technical Specifications

Ultimate capability parameters
FPC Layers1-8 layers
Rigid-Flex4-16 layers (rigid + flex zones)
Bend Life≥1,000,000 cycles (dynamic flex)
Min Bend Radius0.1mm (single layer)
Base MaterialPolyimide (PI) 12.5-125μm
StiffenersPI / Stainless steel / FR-4
EMI ShieldingCopper foil / silver paste shield
Impedance±3% differential impedance

Starting From

$8.00

Lead Time: 5-7 days

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Typical Applications

Foldable Phones
Smart Watches
Medical Endoscopes
Drone Gimbals
Automotive Dashboards

Why Choose JCPCB for Advanced PCBs?

Dedicated Advanced Lines

Separate advanced PCB production lines with LDI exposure, laser drilling, AOI+X-ray full inspection — all equipment under 2 years old

80+ Senior Engineers

Average 15 years PCB engineering experience, each handling 500+ advanced board projects per year

±1% Impedance Control

TDR-measured impedance reports, differential/single-ended/coplanar waveguide all covered

Zero-Defect Promise

Advanced board defect rate <0.1%, far exceeding industry average. Full refund + free reprint on any failure

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