HDI (High Density Interconnect) boards are used in smartphones, wearables, medical devices, and any product where routing density and miniaturization matter.
What defines HDI
- Micro vias (laser drilled, typically 0.1mm)
- Blind and buried vias
- Fine lines and spaces (3/3 mil or less)
- Multiple buildup layers
What your manufacturer needs
- Laser drill capability
- Sequential lamination experience
- Fine line imaging equipment
- Reliable via filling and plating
HDI is not something every factory can do well. Confirm your manufacturer has real HDI production experience before committing your design.
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