Layer stackup is one of the most important decisions in PCB design. It affects signal integrity, EMI performance, impedance control, power distribution, and manufacturing cost.
Common stackups
- 2-layer: signal on both sides, ground pours where space allows
- 4-layer: signal, ground, power, signal — most common for digital
- 6-layer: extra signal layers for dense routing
- 8-layer and above: complex designs with multiple signal and plane layers
Key principles
- Always include a continuous ground plane
- Keep high-speed signals on layers adjacent to ground
- Route sensitive signals on inner layers between planes
- Match layer symmetry for warpage control
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